Requisition Number :
09-11780
Job Title :
Engineer, Principal-Packaging
Job Category :
Engineering
Position Type :
IC Packaging
Shift :
1st shift - Day
Candidate Type :
Full-time employee
Percent of Travel Required :
10% - 25%
Descripti...
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packaging issues. Consult on packaging problems & improvement in packaging process
-Work with marketing and chip lead to select packages and define packaging..
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Job Title: Principal Product Manager
Profession: Computer Engineering and Information Technology -> Technology Management
Principal Product..
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Description : -Design and develop custom advanced wirebond and flipchip packages substrate/module with supporting data including characterization, qualification, production readiness, cost effectiveness, and reliability -Ensure package design follow
...
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Description : -Design and develop custom advanced wirebond and flipchip packages substrate/module with supporting data including characterization, qualification, production readiness, cost effectiveness, and reliability-Ensure package design follow S
...
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Responsibilities: Deploy the HP/Opsware Software (Server Automation, Network Automation, & Operation Orchestration) on client premises . Facilitate workshops / design sessions with key client decision makers to create the overall business solution, t
...
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Job Title :
Engineer, Principal-Packaging
Job Category :
Engineering
Position Type :
IC Packaging... on packaging problems & improvement in packaging..
-
We're looking for a Software Engineer with significant... issues and experience working with hardware engineers and with bus and logic analyzers is also highly..
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Principal Product Engineer Responsibilities: We are looking for a technical lead to work... Electrical and thermal packaging experience desired..
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group of senior file system engineers on performance... plus
Knowledge of file system internals, Linux packaging, assembly language and debugging tools such as..
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